Palapala PTFE GBK i hoʻololi ʻia

Nā Mea Kiko: Hoʻololi ʻia ka resin PTFE, me ka fiber composite GBK e like me ke kākoʻo.
Kaʻina Hana: Mālama ʻo RANA i ka hāʻawi like ʻana o ka lole fiber aniani i loko o ka matrix PTFE ma o ke kaʻina "wela-press melting".
Core: ʻO ka hui pū ʻana o nā ʻano "antistatic + corrosion resistance" o ka PTFE i hoʻololi ʻia a me ka "ikaika kiʻekiʻe + kūpaʻa luhi" o GBK fiber e hāʻawi i ka lining Sheet me nā pono ʻelua o ka antistatic (pale i ka particle adsorption) a me ka lōʻihi -paʻi puʻe (ʻaʻohe māwae ma hope o 100,000 cycles).

Pōmaikaʻi: Ua hōʻoia ʻia e kahi hui loea o Taiwan, ʻoi aku ka liʻiliʻi o ka nui o ka adsorption particle surface ma mua o 5 particles/m² ke hoʻohana ʻia i loko o kahi papa hana semiconductor Class 10 maʻemaʻe (Pepa maʻamau ʻoi aku ka nui a i ʻole like me 20 particles), me ka pae pale wela o -200 degere a 280 degere a ʻoi aku ma mua o 20 mau patent kumu hoʻohālike.
Nā Manaʻo Hoʻohana: Hoʻohana ʻia i ka hana ʻana i ka wafer semiconductor (e laʻa, nā pahu mālama photoresist) a me ka hoʻomaʻemaʻe ʻana o nā mea uila (e laʻa, nā pahu hoʻomaʻemaʻe PCB) e koi ana i ka antistatic a me ka maʻemaʻe kiʻekiʻe. Hāʻawi ia i nā ʻōnaehana no SMIC a me BOE, e kōkua ana i nā mea kūʻai aku e hōʻemi i ka nui o nā hemahema o ka huahana i hoʻokumu ʻia e ka electrostatic particle adsorption (eg, chip defect rate i hoʻemi ʻia e 2%).

Nā huahana pale: ua hoʻololi ʻia ka pepa PTFE gbk, ua hoʻololi ʻo Kina i nā mea hana pepa PTFE gbk, nā mea hoʻolako, nā hale hana